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Patent Searching and Data


Title:
INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING SYSTEM, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/085283
Kind Code:
A1
Abstract:
This information processing device outputs information pertaining to setting conditions for a molding machine for feeding a molten material into the cavity of a die to mold a molded article, the information processing device including: at least one storage device that stores at least one item of reference waveform data that is waveform data detected by a sensor provided to the molding machine or to the die at the time of non-defective molding of a prescribed molded article and that serves as a reference; and a molding condition provision unit that references the storage device and acquires reference waveform data, acquires at least one item of waveform data for one shot during molding of the molded article from the sensor, uses a machine learning model into which are inputted at least one setting condition value and waveform data for when molding is performed at said setting condition value, the machine learning model performing learning so that the difference between the waveform data for when molding is performed and the reference waveform data decreases, processes at least one setting condition value and waveform data for when molding is performed at said setting condition value, and thereby outputs at least one setting condition value at which the sensor detects waveform data that is identical to or similar to the reference waveform data.

Inventors:
KADOYA TAKANORI (JP)
UCHIYAMA YUSUKE (JP)
OKA HIROKI (JP)
Application Number:
PCT/JP2022/041605
Publication Date:
May 19, 2023
Filing Date:
November 08, 2022
Export Citation:
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Assignee:
MAZIN INC (JP)
International Classes:
B29C45/76; B22D17/32; B29C39/44; B29C49/78
Domestic Patent References:
WO2021091191A12021-05-14
Foreign References:
JP2019014187A2019-01-31
JP2020062848A2020-04-23
JPH07205230A1995-08-08
US20160158985A12016-06-09
Other References:
HATAKEYAMA-SATO, KEN: "Machine Learning for Material Science", THE BRAIN & NEURAL NETWORKS, vol. 28, no. 1, 5 March 2021 (2021-03-05), pages 20 - 27, XP093067074
Attorney, Agent or Firm:
OHNO Seiji et al. (JP)
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