Title:
INFORMATION PROCESSING SYSTEM AND INFORMATION PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/223975
Kind Code:
A1
Abstract:
An information processing system, comprising a first processor configured to receive location information indicating a location of a construction vehicle located within a construction site; receive local image data of an area around the construction vehicle, wherein the area around the construction vehicle comprises a portion of the construction site that is less than the entire construction site; generate local three-dimensional (3D) information based on the location information and the local image data; and output the local 3D information to a server; and the server, wherein the server stores global 3D information of the construction site including a topography of the entire construction site and wherein the server is configured to update the global 3D information of the construction site based on the local 3D information output by the first processor.
Inventors:
HANEDA NAOYA (JP)
YASUDA NORIO (JP)
YASUDA MIKITA (JP)
YASUDA NORIO (JP)
YASUDA MIKITA (JP)
Application Number:
PCT/JP2023/017961
Publication Date:
November 23, 2023
Filing Date:
May 12, 2023
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G01C11/00; E02F9/26; G01C15/00; G01C21/00; G06T17/05; G09B29/00
Foreign References:
| US20190020867A1 | 2019-01-17 | |||
| US20090202109A1 | 2009-08-13 | |||
| US20120136525A1 | 2012-05-31 | |||
| US20150361642A1 | 2015-12-17 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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