Title:
INFRARED ABSORBING COMPOSITION, INFRARED CUT FILTER, LAMINATION, PATTERN FORMING METHOD, AND SOLID-STATE IMAGE CAPTURING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2016/186050
Kind Code:
A1
Abstract:
The present invention provides: an infrared absorbing composition that is used to form an infrared cut filter for a solid-state image capturing element having the infrared cut filter, that has an absorption peak at or above a wavelength of 650 nm, and that contains at least one kind of infrared absorber selected from polymethine dyes; a pattern forming method using the infrared absorbing composition; an infrared cut filter formed by curing the infrared absorbing composition; and a laminated body and solid-state image capturing element that include the infrared cut filter.
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Inventors:
OOTA KAZUYA (JP)
SASAKI DAISUKE (JP)
HIRAI YUKI (JP)
OKAWARA TAKAHIRO (JP)
SHIMADA KAZUTO (JP)
ARIMURA KEISUKE (JP)
SASAKI DAISUKE (JP)
HIRAI YUKI (JP)
OKAWARA TAKAHIRO (JP)
SHIMADA KAZUTO (JP)
ARIMURA KEISUKE (JP)
Application Number:
PCT/JP2016/064366
Publication Date:
November 24, 2016
Filing Date:
May 13, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C09B23/00; G02B5/22; H01L27/14
Domestic Patent References:
WO2015056734A1 | 2015-04-23 | |||
WO2012169447A1 | 2012-12-13 |
Foreign References:
JP2007271745A | 2007-10-18 | |||
JP2007141876A | 2007-06-07 | |||
JP2008091535A | 2008-04-17 | |||
JP2016045372A | 2016-04-04 | |||
JP2015203863A | 2015-11-16 |
Other References:
See also references of EP 3299422A4
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
中島 順子 (JP)
中島 順子 (JP)
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