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Title:
INFRARED BAKING DEVICE AND ELECTRONIC COMPONENT BAKING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2019/131791
Kind Code:
A1
Abstract:
The purpose of the invention is to provide an infrared baking device wherein a temperature profile during baking can easily be adjusted and that can batch process a large volume of items to be baked, and an electronic component baking method using same. An infrared baking device is provided with a furnace 21 with a sealable internal space that allows an opening to be opened and closed with an opening-closing cover, a stand 34 for an item to be baked on which an item to be baked can be placed and that can be inserted and removed through the opening, a heater lamp 31 that heats the item to be baked with infrared light, and a thermocouple 32c on the stand 34 for the item to be baked. The furnace wall 23 of the furnace 21 collects infrared light from the heater lamp 31 and irradiates same on the stand 34 for the item to be baked. The stand 34 for the item to be baked is a wide tray 34. The thermocouple 32c is provided in a contact member 32a contacting the tray 34. The tray 34 and the contact member 32a are made of the same material that absorbs the infrared light.

Inventors:
ONISHI Yasuhiro (4-3, Shimaya 4-chome, Konohana-ku, Osaka-sh, Osaka 24, 〒5540024, JP)
IBUSUKI Sadayuki (1585-5 Haruyamacho, Kagoshima-sh, Kagoshima 04, 〒8992704, JP)
Application Number:
JP2018/047931
Publication Date:
July 04, 2019
Filing Date:
December 26, 2018
Export Citation:
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Assignee:
YONEKURA MFG. CO., LTD. (4-3 Shimaya 4-chome, Konohana-ku Osaka-sh, Osaka 24, 〒5540024, JP)
DIV CO., LTD. (1585-5, Haruyamacho Kagoshima-sh, Kagoshima 04, 〒8992704, JP)
International Classes:
F27D11/12; F27B17/00; F27D3/12; H01G4/30; H01G13/00
Attorney, Agent or Firm:
KITAMURA Koji et al. (Seiju IP Firm, AP Bldg. 4-5-14, Nishitenma, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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