Title:
INFRARED CUT-OFF FILTER AND MANUFACTURING METHOD FOR INFRARED CUT-OFF FILTER
Document Type and Number:
WIPO Patent Application WO/2023/106185
Kind Code:
A1
Abstract:
Provided is an infrared cut-off filter and a manufacturing method therefor, the infrared cut-off filter including: a glass substrate 11; a first absorption layer 21 that is disposed on one surface, a surface 11a, of the glass substrate 11, and that contains an infrared-absorbing pigment and a surfactant; and a second absorption layer 31 that is disposed on a surface 11b of the glass substrate 11, which is different from the surface on which the first absorption layer 21 is disposed, and that contains a surfactant and at least one selected from an ultraviolet-absorbing agent and an infrared-absorbing pigment.
Inventors:
ORITA RYOJI (JP)
Application Number:
PCT/JP2022/044303
Publication Date:
June 15, 2023
Filing Date:
December 01, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G02B5/22; B32B1/00
Domestic Patent References:
| WO2019177009A1 | 2019-09-19 | |||
| WO2019176975A1 | 2019-09-19 |
Foreign References:
| JP2021081520A | 2021-05-27 | |||
| JP2005031654A | 2005-02-03 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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