Title:
INFRARED DETECTION ELEMENT, INFRARED DETECTION MODULE, AND METHOD FOR MANUFACTURING INFRARED DETECTION MODULE
Document Type and Number:
WIPO Patent Application WO/2013/084787
Kind Code:
A1
Abstract:
An infrared detection element (15) has a first substrate (36) bonded on the front surface side of a pyroelectric substrate (20). Due to the fact that the first substrate (36) has a thermal expansion coefficient smaller than that of the pyroelectric substrate (20), deformation of the pyroelectric substrate (20) due to thermal expansion can be suppressed by means of the first substrate (36). Furthermore, due to the fact that a thermal expansion coefficient difference (D) is 8.9 ppm/K or less, a difference between the thermal expansion coefficient of the first substrate (36) and that of the pyroelectric substrate (20) does not become too large, and deformation of the infrared detection element (15) due to the difference between the thermal expansion coefficient of the first substrate (36) and that of the pyroelectric substrate (20) can be suppressed.
Inventors:
KONDO JUNGO (JP)
SUZUKI KENJI (JP)
SUZUKI KENJI (JP)
Application Number:
PCT/JP2012/080926
Publication Date:
June 13, 2013
Filing Date:
November 29, 2012
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L37/02; G01J1/02
Domestic Patent References:
| WO2012114579A1 | 2012-08-30 |
Foreign References:
| JPS6246217A | 1987-02-28 | |||
| JPH05235428A | 1993-09-10 | |||
| JPS62285029A | 1987-12-10 | |||
| JP2000164946A | 2000-06-16 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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Claims: