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Patent Searching and Data


Title:
INFRARED DETECTOR
Document Type and Number:
WIPO Patent Application WO/2023/248575
Kind Code:
A1
Abstract:
This infrared detector comprises: a package having a base part, first to third lead pins, and a cap part; and a plurality of thermopile chips disposed on a main surface of the base part. First and second thermopile chips are electrically connected in series. A first chip unit, which includes the first and second thermopile chips, and a second chip unit, which includes a third thermopile chip, are electrically connected in parallel. The first and second lead pins are disposed as aligned along a second direction with a first straight line therebetween. The first and third lead pins are disposed as aligned along a first direction with a second straight line therebetween. The first thermopile chip is disposed on the second straight line and disposed on a straight line linking the first and third lead pins. The second and third thermopile chips are disposed on the first straight line so as to be aligned with a reference position therebetween.

Inventors:
SHIBAYAMA KATSUMI (JP)
YOKINO TAKAFUMI (JP)
MUTO MASAAKI (JP)
KATO KATSUHIKO (JP)
Application Number:
PCT/JP2023/013848
Publication Date:
December 28, 2023
Filing Date:
April 03, 2023
Export Citation:
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Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01J1/02
Foreign References:
JP2019518960A2019-07-04
JP2009128227A2009-06-11
CN111189548A2020-05-22
US20170153144A12017-06-01
CN106969842A2017-07-21
JP2006105651A2006-04-20
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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