Title:
INFRARED DETECTOR
Document Type and Number:
WIPO Patent Application WO/2023/248575
Kind Code:
A1
Abstract:
This infrared detector comprises: a package having a base part, first to third lead pins, and a cap part; and a plurality of thermopile chips disposed on a main surface of the base part. First and second thermopile chips are electrically connected in series. A first chip unit, which includes the first and second thermopile chips, and a second chip unit, which includes a third thermopile chip, are electrically connected in parallel. The first and second lead pins are disposed as aligned along a second direction with a first straight line therebetween. The first and third lead pins are disposed as aligned along a first direction with a second straight line therebetween. The first thermopile chip is disposed on the second straight line and disposed on a straight line linking the first and third lead pins. The second and third thermopile chips are disposed on the first straight line so as to be aligned with a reference position therebetween.
Inventors:
SHIBAYAMA KATSUMI (JP)
YOKINO TAKAFUMI (JP)
MUTO MASAAKI (JP)
KATO KATSUHIKO (JP)
YOKINO TAKAFUMI (JP)
MUTO MASAAKI (JP)
KATO KATSUHIKO (JP)
Application Number:
PCT/JP2023/013848
Publication Date:
December 28, 2023
Filing Date:
April 03, 2023
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
G01J1/02
Foreign References:
JP2019518960A | 2019-07-04 | |||
JP2009128227A | 2009-06-11 | |||
CN111189548A | 2020-05-22 | |||
US20170153144A1 | 2017-06-01 | |||
CN106969842A | 2017-07-21 | |||
JP2006105651A | 2006-04-20 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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