Title:
INFRARED IMAGING DEVICE, FABRICATION METHOD THEREFOR, AND SIMULATION INFRARED SPHERICAL CAMERA
Document Type and Number:
WIPO Patent Application WO/2019/153322
Kind Code:
A1
Abstract:
Provided are an infrared imaging device having a flexible spherical structure, a fabrication method for said device, and a simulation infrared spherical camera. The infrared imaging device having a flexible spherical structure comprises: a substrate and an infrared detector array located on an inner surface of the substrate, wherein the substrate is a flexible spherical substrate. The infrared imaging device having a flexible spherical structure, the fabrication method for said device, and the simulation infrared spherical camera of the present disclosure allow for resilience to repeated bending and can be applied to the fields of wearable devices, bionic tissue, human-computer interaction and the like. The biological integration capability of infrared photoelectric imaging devices is substantially improved, the fabrication process is more mature, and the processing cost is low.
Inventors:
XU YUN (CN)
BAI LIN (CN)
CHEN HUAMIN (CN)
SONG GUOFENG (CN)
CHEN LIANGHUI (CN)
BAI LIN (CN)
CHEN HUAMIN (CN)
SONG GUOFENG (CN)
CHEN LIANGHUI (CN)
Application Number:
PCT/CN2018/076409
Publication Date:
August 15, 2019
Filing Date:
February 12, 2018
Export Citation:
Assignee:
INST SEMICONDUCTORS CAS (CN)
International Classes:
H01L27/146; H04N5/33
Foreign References:
| CN105509891A | 2016-04-20 | |||
| CN105509891A | 2016-04-20 | |||
| CN105509891A | 2016-04-20 | |||
| CN102226719A | 2011-10-26 | |||
| CN102226719A | 2011-10-26 | |||
| CN105118886A | 2015-12-02 | |||
| CN105118886A | 2015-12-02 | |||
| US8895925B2 | 2014-11-25 |
Other References:
耿红艳等 (GENG, Hongyan et al.) 红外探测器倒装互连技术进展 (Flip Chip Bonding Technology for IR Detectors) 红外与激光工程 (Infrared and Laser Engineering) 20140331 43 3
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
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