Title:
INFRARED SENSOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/181717
Kind Code:
A1
Abstract:
Provided is an infrared sensor device whereby temperature variation of a heat-sensitive element due to thermal radiation from a base member can be suppressed, and sensitivity and precision can be enhanced. The infrared sensor device pertaining to the present invention is provided with an infrared sensor body 1 and a base member 11 in which the infrared sensor body is mounted to an upper part thereof, the infrared sensor body being provided with an insulating substrate 2, a detection heat-sensitive element 3A and a compensating heat-sensitive element 3B provided to the insulating substrate, a pair of detection-side wirings provided to the insulating substrate and connected to the detection heat-sensitive element, and a pair of compensating-side wirings connected to the compensating heat-sensitive element, the base member having a groove part 12d in the upper part thereof, and the groove part penetrating through and extending from one side surface of the base member to the other side surface of the base member and passing directly below the detection heat-sensitive element and directly below the compensating heat-sensitive element.
Inventors:
HIRANO SHINGO (JP)
NAKAMURA KENJI (JP)
SHIRATA KEIJI (JP)
NAKAMURA KENJI (JP)
SHIRATA KEIJI (JP)
Application Number:
PCT/JP2019/010491
Publication Date:
September 26, 2019
Filing Date:
March 14, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
G01J1/02; G01J5/02; G01J5/10
Foreign References:
| JPH11118596A | 1999-04-30 | |||
| US20170016762A1 | 2017-01-19 | |||
| DE19525071A1 | 1997-01-16 |
Attorney, Agent or Firm:
TAKAOKA Ryoichi (JP)
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