BACKGROUND

[0001] The disclosure generally relates to induction cooking systems, and in particular, temperature sensing in induction cooking systems.

SUMMARY

[0002] In one embodiment, the disclosure provides an induction cooking system. The induction cooking system includes a base, one or more side walls, an induction coil, and an infrared temperature sensor. The base includes a base surface associated therewith. The base surface includes a window. The window is disposed within the base surface. The one or more side walls define a well above the base surface. The well is configured to receive a vessel disposed above the base surface. The induction coil is disposed within the base. The induction coil defines a first surface that is disposed below the base surface. The induction coil also defines a second surface that is disposed opposite from the first surface. The induction coil further defines an aperture. The aperture is disposed adjacent to the window and extends from the first surface toward the second surface. The infrared temperature sensor is disposed adjacent to the window and within the aperture.

[0003] In another embodiment, the disclosure provides an induction cooking system. The induction cooking system includes a base, one or more side walls, an induction coil, an infrared temperature sensor, and an electronic controller. The base includes a base surface associated therewith. The base surface includes a window. The window is disposed within the base surface. The one or more side walls define a well above the base surface. The well is configured to receive a vessel disposed above the base surface. The induction coil is disposed within the base. The induction coil defines an aperture. The aperture is disposed adjacent to the window. The infrared temperature sensor is disposed adjacent to the window and within the aperture. The electronic controller is electrically coupled to the infrared temperature sensor. The electronic controller is configured to determine a compensated temperature measurement based at least in part on a material of the window and on a temperature measurement taken by the infrared temperature sensor. [0004] Other aspects of the disclosure will become apparent by consideration of the detailed description and accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005] FIG. 1 is a perspective view of an induction cooking system, according to some embodiments of the disclosure.

[0006] FIG. 2 is cross-sectional schematic side view of an induction cooking system taken along line 2-2' of FIG. 4, according to some embodiments of the disclosure.

[0007] FIG. 3 is a block diagram of an induction cooking system, according to some embodiments of the disclosure.

[0008] FIG. 4 is a top view of a first surface of an induction coil included in the induction cooking system illustrated in FIG. 3.

[0009] FIG. 5 is a top view of a first surface of an induction coil, according to some embodiments of the disclosure.

[0010] FIG. 6 is cross-sectional schematic side view of an induction cooking system including the induction coil illustrated in FIG. 5 taken along line 6-6' of FIG. 5.

[0011] The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the disclosure.

DETAILED DESCRIPTION

[0012] Before any embodiments of the disclosure are explained in detail, it is to be understood that the disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the following drawings. The disclosure is capable of other embodiments and of being practiced or of being carried out in various ways.

[0013] FIG. 1 is a perspective view of an induction cooking system 100, according to some embodiments of the disclosure. The dry well induction cooking system 100 includes a base 105 and one or more side walls 110 defining a well 115. Although illustrated as a cylinder, the induction cooking system 100 may be a variety of shapes and/or profiles, including but not limited to, a circle, a rectangle or a square.

[0014] The well 115 is configured to receive a vessel 116 such as, but not limited to, a pot or pan, e.g., a hotel pan (FIG. 2). In some embodiments, the vessel 116 is constructed of stainless steel. In such an embodiment, the vessel 116 may be made substantially of 300-series stainless steel (which has very low magnetic permeability). In other embodiments, the vessel 116 is made of another ferromagnetic material such as iron or a grade of steel (e.g., 400-series stainless steel) that is ferromagnetic.

[0015] FIG. 2 is cross-sectional schematic side view of the induction cooking system 100, according to some embodiments of the disclosure. As illustrated, the induction cooking system 100 can include a ledge 118. The vessel 116 includes a rim 125, which protrudes from the top edge of the vessel 116 and which is configured to align the vessel within the well 115 and to rest on the ledge 118 at the top portion of the well 115 such that the weight of the vessel 116 is supported by the rim 125 of the vessel 116 rather than the vessel bottom.

[0016] The base 105 includes, among other components, an induction coil 130, a base surface 135, an infrared temperature sensor 140, and an electronic controller 145. The induction coil 130 is configured to produce an oscillating magnetic field operating at, e.g., 20 to 50 kHz. In operation, the oscillating magnetic field induces a current in the vessel 116 placed near (or above) the base surface 135. The oscillating magnetic field heats the material of the vessel 116 by generating small eddy currents within the material as well as by causing oscillation of magnetic dipoles within the material.

[0017] The well 115 is configured to receive the vessel 116 disposed above and not in contact with the base surface 135. Specifically, a gap 147 exists between the bottom of the vessel 116 and the base surface 135.

[0018] The induction coil 130 defines, among other features, a first recess or aperture 150, a first surface 155, and a second surface 160. The first surface 155 is disposed adjacent (e.g., below) the base surface 135 and defines, among other features, a center 165 and a periphery 170. The second surface 160 is disposed opposite the first surface 155. The first aperture 150 extends from the first surface 155 to the second surface 160. In some embodiments, the first aperture 150 need not extend all the way from the first surface 155 to the second surface 160. In some embodiments, the first aperture 150 is located at the center 165 of the first surface 155, as illustrated in FIG. 2. The first aperture 150 is an advantageous location for placement of the infrared temperature sensor 140 since this region is free of wires from the induction coil 130.

[0019] In certain embodiments, the base 105 is sealed from the well 115 by the base surface 135 (e.g., to separate the coil and electronics from the cooking area). In some implementations, the base surface 135 includes a type of bulk molding compound (BMC). BMC is a glass-fiber reinforced thermoset polyester material.

[0020] The infrared temperature sensor 140 measures a temperature of the vessel 116 placed near (or above) the base surface 135 without requiring direct contact between the infrared temperature sensor 140 and the vessel 116. In the embodiment illustrated in FIG. 2, the infrared temperature sensor 140 is located within the first aperture 150 of the induction coil 130. The base surface 135, however, may block a portion of the infrared radiation emitted by the vessel 116 (e.g., the base surface 135 may block light with wavelength ranging generally from 0.75 micrometers to about 15 micrometers). In order to allow a portion of the total infrared radiation emitted by the vessel 116 to be sensed by the infrared temperature sensor 140, a window 175 may be provided within the base surface 135, where the window 175 includes material that is transparent to infrared wavelengths. In some embodiments, the window 175 includes a type of polyethylene plastic, which while it is naturally milky white is nevertheless sufficiently transparent to infrared wavelengths, particularly when only a relatively thin layer is used (e.g., between 1-2 millimeters). In other embodiments, the window 175 may include, but is not limited to, silicon or germanium. The window 175 is disposed adjacent the infrared temperature sensor 140 and enables the infrared temperature sensor 140 to sense a portion of the total infrared radiation emitted by the vessel 116. In the embodiment illustrated in FIG. 2, the window 175 is also disposed adjacent the first aperture 150 of the induction coil 130. The infrared temperature sensor 140 measures an amount of infrared radiation transmitted through the window 175 (by the vessel 116). In some embodiments, the infrared temperature sensor 140 determines a temperature measurement based at least in part on the amount of infrared radiation transmitted through the window 175.

[0021] FIG. 3 is a block diagram of an embodiment of the induction cooking system 100 including electronic controller 145. The electronic controller 145 may be communicatively (e.g., electrically) connected to a variety of modules or components of the induction cooking system 100. For example, in various embodiments the electronic controller 145 is connected to one or more of: the induction coil 130, the infrared temperature sensor 140, and a power supply 180. The electronic controller 145 includes combinations of hardware and software that are operable to, among other things, receive temperature measurements from the infrared temperature sensor 140 and regulate the oscillating magnetic field generated by the induction coil 130 based on the received temperature measurements.

[0022] In some embodiments, the electronic controller 145 includes a plurality of electrical and electronic components that provide power, operational control, and protection to the components and modules within the electronic controller 145 and/or the induction cooking system 100. For example, the electronic controller 145 includes, among other components, an electronic processor 185 (e.g., a microprocessor, a microelectronic controller, or another suitable programmable device) and a memory 190. The electronic processor 185 and the memory 190, as well as the various modules connected to the electronic controller 145, are connected by one or more control and/or data buses. The control and/or data buses are shown generally in FIG. 3 for illustrative purposes. The use of one or more control and/or data buses for the interconnection between and communication among the various modules and components would be known to a person skilled in the art in view of the disclosure described herein. In some embodiments, the electronic controller 145 is implemented partially or entirely on a semiconductor (e.g., a field- programmable gate array [FPGA] semiconductor) chip, such as a chip developed through a register transfer level (RTL) design process.

[0023] The memory 190 includes, for example, a program storage area and a data storage area. The program storage area and the data storage area can include combinations of different types of memory, such as read-only memory (ROM), random access memory (RAM) (e.g., dynamic RAM [DRAM], synchronous DRAM [SDRAM], etc.), electrically erasable programmable read-only memory (EEPROM), flash memory, a hard disk, an SD card, or other suitable magnetic, optical, physical, or electronic memory devices. The electronic processor 185 is connected to the memory 190 and executes software instructions that are capable of being stored in a RAM of the memory 190 (e.g., during execution), a ROM of the memory 190 (e.g., on a generally permanent basis), or another non-transitory computer readable medium such as another memory or a disc. Software included in the implementation of the induction cooking system 100 can be stored in the memory 190 of the electronic controller 145. The software includes, for example, firmware, one or more applications, program data, filters, rules, one or more program modules, and other executable instructions. The electronic controller 145 is configured to retrieve from memory and execute, among other things, instructions related to the control processes and methods described herein. In other constructions, the electronic controller 145 includes additional, fewer, or different components.

[0024] The power supply 180 supplies a nominal AC or DC voltage to the electronic controller 145 or other components or modules of the induction cooking system 100 (e.g., the induction coil 130, the infrared temperature sensor 140, etc.). The power supply 180 is powered by, for example, a power source having nominal line voltages between 100V and 240V AC and frequencies of approximately 50-60Hz. The power supply 180 is also configured to supply lower voltages to operate circuits and components within the electronic controller 145 or the induction cooking system 100. In some embodiments, the electronic controller 145 adjusts an energy output of the induction coil 130 based at least in part on a temperature measurement taken by the infrared temperature sensor 140.

[0025] The material used in the window 175 can affect the accuracy of the temperature measurements taken by the infrared temperature sensor 140. In general, the amount of infrared radiation which impinges on the infrared temperature sensor 140 is less than the amount of infrared radiation which is emitted by a portion of the vessel 116, due to the window 175 in most cases transmitting less than 100% of the incident infrared light.

[0026] Thus, the difference between the amount of infrared radiation emitted by the vessel 116 and the amount of infrared radiation transmitted through the window 175 is based in part on the material used for the window 175, particularly the light transmission properties of the material in the infrared range. In various embodiments, the window 175 comprises a material which transmits a relatively high percentage of infrared light. Further, to compensate for losses which occur due to less than complete transmission of infrared radiation through the window 175, in some embodiments the electronic controller 145 is further operable to compensate for the effect of the material used in the window 175 on the accuracy of the temperature

measurements taken by the infrared temperature sensor 140.

[0027] In some embodiments, the electronic controller 145 determines a compensated temperature measurement based on a temperature measurement taken by the infrared temperature sensor 140 and the material of the window 175. In some embodiments, the electronic controller 145 adjusts the energy output of the induction coil 130 based at least in part on the compensated temperature measurement. The electronic controller 145 may use an algorithm or correction factor to calculate the compensated temperature measurement. As an example, the electronic controller 145 may use a constant multiplicative factor, for example, when the material used in the window 175 contributes a relatively flat attenuation factor with respect to wavelength. As a further example, the electronic controller 145 may use a

multiplicative correction that is a function of the temperature indicated by the infrared temperature sensor 140. For example, in some embodiments, the electronic controller 145 compensates using the following equation:

compensated — Λ X X T measured ) G)

wherein,

T compensated = compensated temperature,

a = additive constant,

x = function of the attenuation curve with respect to frequency, and

^measured ⁼ temperature measured by the infrared temperature sensor 140.

[0028] FIG. 4 illustrates a top view of the first surface 155 of the induction coil 130 according to the embodiment of FIG. 2. In some embodiments, the first and second surfaces 155, 160 are generally circular. In other embodiments, the first and second surfaces 155, 160 may be a variety of shapes, including but not limited to, rectangular or square. The accuracy of the infrared temperature sensor 140 increases when it is positioned closer to the area of the vessel 116 that emits the greatest amount of infrared radiation. As explained above, in some embodiments, such as the embodiment illustrated in FIG. 2, the infrared temperature sensor 140 may be disposed within the first aperture 150 at the center 165 of the first surface 155. However, the greatest amount of infrared radiation may not be emitted by the vessel 116 at the center 165 of the first surface 155. Instead, in some instances the induction coil 130 has the greatest magnetic field strength (and hence produces the greatest amount of infrared radiation) in what is referred to herein as a power ring region 195 (illustrated in FIG. 4 as a broken circular line). In some embodiments, where the first and second surfaces 155, 160 of the induction coil 130 are generally circular, the power ring region 195 is generally located midway between the center 165 and the periphery 170, as illustrated in FIG. 4.

[0029] As illustrated in FIG. 5, in some embodiments the induction coil 130 further includes a second aperture 200 disposed between the first surface 155 and the second surface 160.

Typically, induction coils are substantially symmetrical (e.g. having circular symmetry). In some embodiments, however, such as illustrated in FIG. 5, the induction coil includes some asymmetric portions in order to accommodate the second aperture 200. The second aperture 200 is also disposed between the center 165 and the periphery 170 of the first surface 155. In some embodiments, the second aperture 200 is disposed at the power ring region 195 of the induction coil 130. For example, in some embodiments, such as the embodiment illustrated in FIG. 5, where the first and second surfaces 155, 160 are generally circular, the second aperture 200 is disposed midway between the center 165 and the periphery 170. In some embodiments, the second aperture 200 is disposed at about a radial midpoint between the center 165 and the periphery 170. In some embodiments, the second aperture 200 is disposed at a radial midpoint between the center 165 and the periphery 170.

[0030] As illustrated in FIG. 6, in some embodiments the induction cooking system 100 includes an induction coil 130 having a first aperture 150 and a second aperture 200. In such an embodiment, the infrared temperature sensor 140 may be disposed within the second aperture 200 of the induction coil 130. Positioning the infrared temperature sensor 140 within the second aperture 200 enables the infrared temperature sensor 140 to take temperature measurements at or near the power ring region 195. In the embodiment illustrated in FIG. 6, the window 175 is disposed adjacent the second aperture 200 of the induction coil 130.

[0031] Thus, the disclosure provides, among other things, systems and methods of measuring the temperature in induction cooking systems. Various features and advantages of the disclosure are set forth in the following claims.