Title:
INGOT CUTTING APPARATUS AND CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/052827
Kind Code:
A1
Abstract:
Provided are an ingot cutting apparatus and a cutting method, wherein the ingot cutting apparatus comprising at least one coolant pocket storing a coolant to be supplied to a blade is characterized in that the abrasive grain portion of the blade is made to travel through a groove which is provided at an upper part of the coolant pocket at the time of circulation driving, the coolant stored in the coolant pocket touches the abrasive grain portion of the blade and thereby the coolant is supplied to the blade. Consequently, cooling effect in the cutting portion and cleaning effect in the abrasive grain portion of the blade are enhanced by supplying the coolant efficiently to the abrasive grain portion of the blade and supplying the coolant enough even when a large-diameter ingot is cut.
Inventors:
NISHINO, Hidehiko (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
西野英彦 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 白河工場内 Fukushima, 〒9618061, JP)
HIRANO, Yoshihiro (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
西野英彦 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 白河工場内 Fukushima, 〒9618061, JP)
HIRANO, Yoshihiro (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2009/005236
Publication Date:
May 14, 2010
Filing Date:
October 08, 2009
Export Citation:
Assignee:
Shin-Etsu Handotai Co.,Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
NISHINO, Hidehiko (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
西野英彦 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 白河工場内 Fukushima, 〒9618061, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
NISHINO, Hidehiko (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
西野英彦 (〒61 福島県西白河郡西郷村大字小田倉字大平１５０番地信越半導体株式会社 白河工場内 Fukushima, 〒9618061, JP)
International Classes:
H01L21/304; B23D55/00; B23D59/04; B28D5/04
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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