INGOT CUTTING METHOD REUSING WASTE SLUDGE AND SYSTEM USING SAME

Title:

INGOT CUTTING METHOD REUSING WASTE SLUDGE AND SYSTEM USING SAME

Document Type and Number:

WIPO Patent Application WO/2010/150460

Kind Code:

A1

Abstract:

Provided are a silicon ingot cutting method and a cutting system. The method comprises: performing a primary and secondary centrifugal separations on waste slurry produced when a silicon ingot is cut by a wire saw and separating the waste slurry into a solid content, waste sludge, and a secondary separate liquid; collecting the secondary separate liquid and the solid content; adding new abrasive grains and coolant to the collected secondary separate liquid and solid content to prepare a recovered slurry; and supplying the recovered slurry to the wire saw. In the method, the waste sludge is distilled and separated into a solid residue and a residue solution; the solid residue is classified to separate abrasive grains; and the abrasive grains and the residue solution are collected and additionally added when the recovered slurry is prepared. This makes it possible, upon cutting a silicon ingot by using a wire saw while supplying the recovered slurry including abrasive grains and a coolant which are collected from the waste slurry and reused, to cut the silicon ingot while suppressing the degradation of cutting quality and suppressing a cost increase by improving the collection rate.

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Inventors:

HABATA TSUTOMU (JP)
MATSUSHIMA HIDEAKI (JP)
MIYAMOTO KENICHI (JP)
ICHIKAWA SHINNOSUKE (JP)

Application Number:

PCT/JP2010/003467

Publication Date:

December 29, 2010

Filing Date:

May 24, 2010

Export Citation:

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Assignee:

SHINETSU HANDOTAI KK (JP)
HABATA TSUTOMU (JP)
MATSUSHIMA HIDEAKI (JP)
MIYAMOTO KENICHI (JP)
ICHIKAWA SHINNOSUKE (JP)

International Classes:

B24B57/00; B24B27/06; B28D5/04; B28D7/02; H01L21/304

Foreign References:

JP2003225700A	2003-08-12
JP2008200772A	2008-09-04
JP2008213111A	2008-09-18

Attorney, Agent or Firm:

YOSHIMIYA, Mikio (JP)
Good 宮幹夫 (JP)

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