Title:
INGOT CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/073428
Kind Code:
A1
Abstract:
The present invention is an ingot cutting method for cutting a monocrystalline ingot having a cylindrical straight body portion that has been cylindrically ground, and a conical end portion with a mirror finish that has not been cylindrically ground and that is formed on at least one end of the straight body portion, and the ingot cutting method comprises: a step of using a difference in reflection of light between the straight body portion surface that has been cylindrically ground and the conical end portion with a mirror finish that has not been cylindrically ground, and detecting the position of the boundary between the cylindrically ground surface and the surface that has not been cylindrically ground; and a step of performing positioning of a cutting position taking the detected position of the boundary as a base point, then cutting the ingot. Accordingly, provided is an ingot cutting method that can precisely specify the base point of the cutting position and suppress displacement of the cutting position, regardless of diverse monocrystalline ingot diameters and conical end portion shapes.
Inventors:
NAKAGAWA KAZUYA (JP)
Application Number:
PCT/JP2011/006033
Publication Date:
June 07, 2012
Filing Date:
October 28, 2011
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
NAKAGAWA KAZUYA (JP)
NAKAGAWA KAZUYA (JP)
International Classes:
B28D1/10; B24B49/12; B28D5/02; C30B29/06; C30B35/00; H01L21/304
Foreign References:
| JP2007194418A | 2007-08-02 | |||
| JP2003267797A | 2003-09-25 | |||
| JP2000343524A | 2000-12-12 | |||
| JPH09167723A | 1997-06-24 |
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (JP)
Good Miya Mikio (JP)
Good Miya Mikio (JP)
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Claims: