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Patent Searching and Data


Title:
INGOT CUTTING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/119030
Kind Code:
A1
Abstract:
The present invention is an ingot cutting method wherein wire rows are formed by spirally wrapping a wire between a plurality of grooved rollers, and, while the wire is moved back and forth by repeating the unreeling of a predetermined length of the wire from a supply wire reel and the winding of a length less than the predetermined length of the wire onto the supply wire reel, tension is applied to the wire by tension applying mechanisms disposed on the supply wire reel and a recovery wire reel, and the ingot is pressed against the wire rows and thus cut into wafers. In this ingot cutting method, the ingot is cut into wafers by performing control such that the value calculated from A/B × 100 becomes 60 or more, where A represents the winding tension of the wire that is wound on the supply wire reel and is not unreeled, and B represents the winding tension when winding the wire on the supply wire reel. Thus, the provided ingot cutting method using a wire saw is capable of suppressing a break in the wire.

Inventors:
KOBAYASHI, Kenji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
KITAGAWA, Koji (Shin-Etsu Handotai Co. Ltd., 150, Aza Ohira, Oaza Odakura, Nishigo-mura, Nishishirakawa-gu, Fukushima 61, 〒9618061, JP)
Application Number:
JP2016/005113
Publication Date:
July 13, 2017
Filing Date:
December 13, 2016
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO.,LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
B24B27/06; B28D5/04; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA, Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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