Title:
INJECTION MOLD
Document Type and Number:
WIPO Patent Application WO/2023/249262
Kind Code:
A1
Abstract:
The present disclosure relates to an injection mold. According to one embodiment, an injection mold may be provided, wherein the injection mold comprises: a first template comprising a first core; a second template comprising a second core; and a third template disposed between the first template and the second template and comprising a third core that forms a first cavity when mated with the first core of the first template and forms a second cavity when mated with the second core of the second template, wherein the third core comprises an opening portion, and when the third core is mated with the first core and the second core, a first tip portion of the first core and a second tip portion of the second core are positioned in the opening portion so as to face each other, and a third cavity is formed when the first tip portion of the first core and the second tip portion of the second core face each other. The injection mold as above may vary according to the embodiment.
Inventors:
SON CHUNGHYO (KR)
Application Number:
PCT/KR2023/006844
Publication Date:
December 28, 2023
Filing Date:
May 19, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B29C45/32; B29C33/30; B29C45/26; B29C45/27; B29C45/36; B29C45/37; B29C45/40; B29C45/44
Foreign References:
| KR102325042B1 | 2021-11-11 | |||
| KR20090028338A | 2009-03-18 | |||
| KR20130005726U | 2013-10-02 | |||
| KR100994839B1 | 2010-11-16 | |||
| KR101487010B1 | 2015-01-29 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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