Title:
INJECTION MOLDING APPARATUS AND INJECTION MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/111321
Kind Code:
A1
Abstract:
The present application discloses an injection molding apparatus comprising a heat injection unit that heats/melts a conductive material to a flowable temperature and injects this into a mold comprising a cavity forming surface that forms a cavity. The injection molding apparatus comprises: an electrification unit that applies a voltage; and a control unit comprising an electrification control unit that controls the voltage applied by the electrification unit. The mold comprises a plurality of conduction units insulated from one another in at least a portion of the cavity forming surface. The electrification unit applies the voltage between the plurality of conduction units. When the conductive material injected from the heat injection unit contacts the plurality of conduction units, the conductive material is electrified and heated by the voltage applied from the electrification unit under the control of the electrification control unit.
Inventors:
KATO HIDEKAZU (JP)
TANAKA TAKAHIRO (JP)
TANIZAWA HIROKI (JP)
WAKU NAOTO (JP)
IWAMOTO MICHIHISA (JP)
TANAKA TAKAHIRO (JP)
TANIZAWA HIROKI (JP)
WAKU NAOTO (JP)
IWAMOTO MICHIHISA (JP)
Application Number:
PCT/JP2016/050295
Publication Date:
July 14, 2016
Filing Date:
January 07, 2016
Export Citation:
Assignee:
MAZDA MOTOR (JP)
International Classes:
B29C45/72; B29C45/26; B29C45/76
Foreign References:
| JP2004345120A | 2004-12-09 | |||
| JPS57126772A | 1982-08-06 |
Attorney, Agent or Firm:
KOTANI, Etsuji et al. (JP)
Etsuji Kotani (JP)
Etsuji Kotani (JP)
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