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Patent Searching and Data


Title:
INJECTION MOLDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/164099
Kind Code:
A1
Abstract:
An injection molding apparatus comprises: first and second molds; a slide plate which is provided in the first mold so as to move back and forth, and ejects a molded product that has been injection-molded between the first and second molds; and a sensor apparatus which has a fixed sensor disposed in the first mold and a moving sensor disposed in the slide plate and detects the position of the slide plate, wherein the sensor apparatus is detachably attached to the first mold and the slide plate by magnetic force.

Inventors:
PARK, Yong Joo (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
Application Number:
KR2018/014650
Publication Date:
August 29, 2019
Filing Date:
November 26, 2018
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO., LTD. (129 Samsung-ro, Yeongtong-guSuwon-si, Gyeonggi-do, 16677, KR)
International Classes:
B29C45/40; B29C45/17; B29C45/76
Attorney, Agent or Firm:
SELIM INTELLECTUAL PROPERTY LAW FIRM (10F and 11F, Taewoo Bldg. 285, Gangnam-daero,Seocho-gu, Seoul, 06729, KR)
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