INJECTION MOLDING APPARATUS - SAMSUNG ELECTRONICS CO LTD

Title:

INJECTION MOLDING APPARATUS

Document Type and Number:

WIPO Patent Application WO/2019/164099

Kind Code:

A1

Abstract:

An injection molding apparatus comprises: first and second molds; a slide plate which is provided in the first mold so as to move back and forth, and ejects a molded product that has been injection-molded between the first and second molds; and a sensor apparatus which has a fixed sensor disposed in the first mold and a moving sensor disposed in the slide plate and detects the position of the slide plate, wherein the sensor apparatus is detachably attached to the first mold and the slide plate by magnetic force.

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Inventors:

PARK YONG JOO (KR)

Application Number:

PCT/KR2018/014650

Publication Date:

August 29, 2019

Filing Date:

November 26, 2018

Export Citation:

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Assignee:

SAMSUNG ELECTRONICS CO LTD (KR)

International Classes:

B29C45/40; B29C45/17; B29C45/76

Foreign References:

US20010010172A1	2001-08-02
US20170261338A1	2017-09-14
KR101265459B1	2013-05-16
JP4305746B2	2009-07-29
JP3662142B2	2005-06-22

Attorney, Agent or Firm:

SELIM INTELLECTUAL PROPERTY LAW FIRM (KR)

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