Title:
INJECTION MOLDING DEVICE, METHOD FOR MANUFACTURING INJECTION MOLDING DEVICE, AND METHOD FOR SUPPORTING SUB-INJECTION UNIT
Document Type and Number:
WIPO Patent Application WO/2018/020891
Kind Code:
A1
Abstract:
An injection molding device is provided with: at least two mold attachment boards facing each other; molds directly or indirectly attached to the respective mold attachment boards; a main injection unit arranged to be capable of injecting molten resin into a cavity formed when the molds are clamped to each other; and a sub-injection unit formed to be smaller than the main injection unit and arranged to be capable of injecting the molten resin into the cavity. The injection molding device is further provided with a support member for attaching the sub-injection unit to one of the mold attachment boards or one of the molds. The support member is configured to support the sub-injection unit in a direction crossing a mold opening/closing direction of the molds.
Inventors:
ARIMA YUICHIRO (JP)
OGUSHI TAKUYA (JP)
OGUSHI TAKUYA (JP)
Application Number:
PCT/JP2017/022109
Publication Date:
February 01, 2018
Filing Date:
June 15, 2017
Export Citation:
Assignee:
UBE MACHINERY CORP LTD (JP)
International Classes:
B29C45/13
Foreign References:
| JPH07227875A | 1995-08-29 | |||
| JPS63125518U | 1988-08-16 | |||
| JPS60141515A | 1985-07-26 | |||
| JPH04339618A | 1992-11-26 | |||
| JP2007075999A | 2007-03-29 | |||
| JP2009279867A | 2009-12-03 |
Attorney, Agent or Firm:
KISARAGI ASSOCIATES (JP)
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