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Patent Searching and Data


Title:
INJECTION MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2015/045671
Kind Code:
A1
Abstract:
[Problem] To provide an injection molding die capable of effectively cooling a molded article inside a cavity and having a simple structure. [Solution] A movable mold (4) having: a movable mold main body (5); and a gear piece (6) attached to this movable mold main body (5) so as to be relatively movable and having a cavity-formation space (14) for forming a cavity (16). The gear piece (6) comprises a piece-side coolant flow path (28) comprising: an annular flow path (30) surrounding the cavity-formation space (14); a piece-side supply flow path (31) that guides coolant into the annular flow path (30); and a piece-side discharge flow path (32) that guides the coolant out of the annular flow path (30). Inside the cavity (16) can be effectively cooled as a result of: the piece-side coolant flow path (28) being connected to a movable mold main body-side supply flow path (34) for the movable mold main body (5) and a movable mold main body-side discharge flow path (35); and coolant flowing therein as a result of the negative pressure generated by a coolant circulation device (36).

Inventors:
HASHIMOTO MASAOMI (JP)
Application Number:
PCT/JP2014/071536
Publication Date:
April 02, 2015
Filing Date:
August 18, 2014
Export Citation:
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Assignee:
ENPLAS CORP (JP)
International Classes:
B29C45/73; B22C9/06; B22D17/22
Foreign References:
JPH07195443A1995-08-01
JP2003039437A2003-02-13
JPH08216161A1996-08-27
JP2013014075A2013-01-24
JPH1158465A1999-03-02
Attorney, Agent or Firm:
OHNUKI & KOTAKE (JP)
Patent business corporation Onuki smallness Takekuni [Hajime] patent firm (JP)
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