Title:
INJECTION MOLDING METHOD AND INJECTION MOLDING DEVICE FOR TRANSPARENT RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2015/045677
Kind Code:
A1
Abstract:
The present invention effects a reduction in production cost and increases yield of a transparent resin molded article and prevents the generation of defects such as bubbles, weld lines, and sink marks. This injection molding device (2A) for a transparent resin molded article is equipped with: a die (3) for injection molding the transparent resin molded article; and a gate (5) that is provided to the peripheral edge of the die (3) and that is the entrance through which a resin material (R) is injected into the die (3). The thickness dimensions (Ta) of the die (3) are in the range of 15-25 mm, and the ratio of the diameter dimensions (D) of the gate (5) to the thickness dimensions (Ta) of the die (3) is set in the range of 1:6 to 1:3.
Inventors:
BESSHO MASAHIRO (JP)
ISHIKAWA NAOMOTO (JP)
TANEMURA TSUNETOSHI (JP)
ISHIKAWA NAOMOTO (JP)
TANEMURA TSUNETOSHI (JP)
Application Number:
PCT/JP2014/071698
Publication Date:
April 02, 2015
Filing Date:
August 20, 2014
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C45/26; B29C45/16; B29K105/32
Foreign References:
| JP2004359221A | 2004-12-24 | |||
| JPH11198184A | 1999-07-27 | |||
| JPS62180511U | 1987-11-16 | |||
| JP2000006203A | 2000-01-11 | |||
| JP2004243590A | 2004-09-02 |
Attorney, Agent or Firm:
FUJITA, Takaharu et al. (JP)
Takaharu Fujita (JP)
Takaharu Fujita (JP)
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