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Patent Searching and Data


Title:
INJECTION MOLDING METHOD AND INJECTION MOLDING MACHINE
Document Type and Number:
WIPO Patent Application WO/2020/183825
Kind Code:
A1
Abstract:
Previously, a parting opening amount Lm that is a prescribed gap is generated between a movable mold 2m and a fixed mold 2c of a mold 2 during injection filling, a molding injection pressure Pi that is an injection pressure enabling nondefective molding and a molding clamping force Pc that is a mold clamping force enabling nondefective molding are calculated and set as a specific molding condition Dc, and a fast injection speed Vf since an injection start that is faster than an injection speed set under the specific molding condition Dc and a fast injection section Zf at which the fast injection speed Vf is continued are set as a fast injection condition Df. During molding, mold clamping is performed with the molding clamping force Pc, the molding injection pressure Pi is set at a limit pressure Ps, a resin R is injected and filled in the mold 2 under the fast injection condition Df when an injection starts, and the resin R is injected and filled under the specific molding condition Dc when the fast injection section Zf ends.

Inventors:
YODA HOZUMI (JP)
KASUGA NOBUKAZU (JP)
MURATA HIROFUMI (JP)
Application Number:
PCT/JP2019/048156
Publication Date:
September 17, 2020
Filing Date:
December 09, 2019
Export Citation:
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Assignee:
NISSEI PLASTICS IND CO (JP)
International Classes:
B29C45/64; B29C45/67; B29C45/76; B29C45/77
Domestic Patent References:
WO2011161899A12011-12-29
WO2008153336A22008-12-18
WO2011161899A12011-12-29
WO2011161899A12011-12-29
Foreign References:
JP2018176189A2018-11-15
US20110130496A12011-06-02
Other References:
See also references of EP 3939765A4
Attorney, Agent or Firm:
SHIMODA Shigeru et al. (JP)
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