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Patent Searching and Data


Title:
INJECTION MOULDING DIE
Document Type and Number:
WIPO Patent Application WO/2020/250441
Kind Code:
A1
Abstract:
The present invention comprises: a main mould (21) that has a bolt hole (212); a drum insert (22) that has a cover screw hole (222), which is a through-hole comprising a larger-diameter section (2221), a smaller-diameter section (2222) connected to said larger-diameter section (2221), and a bolt hole (2223) connected to said smaller-diameter section (2222) and having a smaller diameter than said smaller-diameter section (2222); a hex socket head bolt (24) that has a threaded section insertable into the bolt hole (212) and the bolt hole (2223), and a head insertable into the smaller-diameter section (2222) of the cover screw hole (222), and mounts the drum insert (22) on the main mould (21); a spacer (25) that is positioned on a step section (2224) formed by the larger-diameter section (2221) and the smaller-diameter section (2222) in the cover screw hole (222); and a cover screw (27) that has a threaded section insertable into the smaller-diameter section (2222) in the cover screw hole (222), and a head insertable into the larger-diameter section (2221) in said cover screw hole (222), and is mounted in said cover screw hole (222) with the spacer (25) in between, wherein the position of the head of the cover screw (27) in relation to the surface of the drum insert (22) is adjusted by the thickness of the spacer (25).

Inventors:
YAMAGUCHI TAKASHI (JP)
TANAKA TAKAHIRO (JP)
Application Number:
PCT/JP2019/023731
Publication Date:
December 17, 2020
Filing Date:
June 14, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC ENG (JP)
International Classes:
B29C45/26; B29C33/42
Foreign References:
JP2017140798A2017-08-17
JPH0674317U1994-10-21
JP2013076603A2013-04-25
Attorney, Agent or Firm:
TAZAWA, Hideaki et al. (JP)
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