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Patent Searching and Data


Title:
INKJET ADHESIVE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2016/117606
Kind Code:
A1
Abstract:
Provided is an adhesive that is applied using an inkjet device, wherein the adhesive can make it difficult for voids to form in an adhesive layer and, after bonding, can reduce outgassing upon exposure to high temperatures and can increase moisture-resistance reliability. An inkjet adhesive according to the present invention comprises: a first photocurable compound having one (meth)acryloyl group; a second photocurable compound having at least two (meth)acryloyl groups; a photoradical initiator; a thermosetting compound having at least one cyclic ether group or cyclic thioether group; and a compound that can react with the thermosetting compound. The compound that can react with the thermosetting compound contains a C8-21 alkyl(meth)acrylate.

Inventors:
TANIKAWA MITSURU (JP)
WATANABE TAKASHI (JP)
FUJITA YUSUKE (JP)
FUJITA YOSHITO (JP)
YAMADA TASUKU (JP)
Application Number:
PCT/JP2016/051576
Publication Date:
July 28, 2016
Filing Date:
January 20, 2016
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J4/02; C09J5/06; C09J11/06; C09J163/00; H01L21/52
Domestic Patent References:
WO2015076235A12015-05-28
Foreign References:
JP2014237814A2014-12-18
JP2010037456A2010-02-18
JP2014063954A2014-04-10
Other References:
See also references of EP 3249022A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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