Title:
INKJET RESIN COMPOSITION AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2017/200271
Kind Code:
A2
Abstract:
The present invention provides an inkjet resin composition comprising: a thermosetting epoxy resin; a monofunctional acrylate monomer; a multifunctional acrylate monomer; a photoinitiator; and an amine synergist. According to the present invention, the inkjet resin composition can improve the heat resistance, chemical resistance and adhesion of a cured resin layer to be formed by curing the same. Particularly, unlike a conventional inkjet resin composition, even if a diluent is used without using a solvent, a resin composition is readily discharged from an inkjet printer, and thus a resin insulating layer can be formed without affecting the characteristics of the printed wiring board.
Inventors:
HIDEHIRA YORIO (JP)
CHOI SUNG HO (KR)
SHIN DONG HEUN (KR)
CHOI SUNG HO (KR)
SHIN DONG HEUN (KR)
Application Number:
PCT/KR2017/005068
Publication Date:
November 23, 2017
Filing Date:
May 16, 2017
Export Citation:
Assignee:
MICROCRAFT KOREA CO LTD (KR)
International Classes:
C09D11/30; B32B15/08; B32B15/20; C09D11/322; C09D163/00; H05K3/12
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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