Title:
INKJET RESIN COMPOSITION AND PRINTED WIRING BOARD FABRICATED USING SAME
Document Type and Number:
WIPO Patent Application WO/2018/225937
Kind Code:
A1
Abstract:
The present invention relates to an inkjet resin composition for use in forming, in an inkjet printing manner, a resin layer that serves as an insulation layer in a printed wiring board.
Inventors:
HIDEHIRA YORIO (JP)
CHOI SUNG HO (KR)
SHIN DONG HEUN (KR)
CHOI SUNG HO (KR)
SHIN DONG HEUN (KR)
Application Number:
PCT/KR2018/003240
Publication Date:
December 13, 2018
Filing Date:
March 21, 2018
Export Citation:
Assignee:
MICROCRAFT KOREA CO LTD (KR)
International Classes:
C09D11/30; C09D11/38; C09D163/00; H05K3/12
Foreign References:
| KR20160057331A | 2016-05-23 | |||
| KR20170020680A | 2017-02-23 | |||
| KR20100050295A | 2010-05-13 | |||
| JP2016196579A | 2016-11-24 | |||
| KR20090084057A | 2009-08-05 |
Attorney, Agent or Firm:
BAE, KIM & LEE IP GROUP (KR)
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