Title:
INKJET-USE HARDENABLE COMPOSITION, HARDENER, AND FLEXIBLE PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/082425
Kind Code:
A1
Abstract:
Provided by the present invention are an inkjet-use hardenable composition, hardener, and flexible printed circuit board. The inkjet-use hardenable composition comprises soluble polyimide resin, photocurable acrylate compound, photopolymerization initiator, and thermosetting resin. The inkjet-use hardenable composition has excellent softness, and at a thickness of less than 20 μm, still has a voltage resistance greater than 2 kV.
Inventors:
LAI BO-HUNG (CN)
SHIH YU-CHIAO (CN)
HUANG TANG-CHIEH (CN)
SHIH YU-CHIAO (CN)
HUANG TANG-CHIEH (CN)
Application Number:
PCT/CN2020/122151
Publication Date:
April 28, 2022
Filing Date:
October 20, 2020
Export Citation:
Assignee:
MICROCOSM TECH CO LTD (CN)
International Classes:
C08G73/10; C09D11/30; G03F7/037
Domestic Patent References:
| WO2007020644A1 | 2007-02-22 |
Foreign References:
| CN110431483A | 2019-11-08 | |||
| CN110582546A | 2019-12-17 | |||
| CN106893101A | 2017-06-27 | |||
| CN102762621A | 2012-10-31 | |||
| CN111154327A | 2020-05-15 | |||
| CN109270792A | 2019-01-25 | |||
| CN101807001A | 2010-08-18 | |||
| CN105085911A | 2015-11-25 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
Download PDF:
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