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Patent Searching and Data


Title:
INORGANIC FIBER MOLDED BODY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2011/055736
Kind Code:
A1
Abstract:
Disclosed is an inorganic fiber molded body which is capable of easily controlling the thickness and surface density, has excellent workability and handling properties, and prevents the deterioration of working environment when processed into applications such as a heat insulating material or a mat. Specifically disclosed is an inorganic fiber molded body which consists of inorganic fiber mat-like aggregate, and to which needling treatment is applied. The needle density of the mat surface exceeds 50 pieces/cm2, and satisfies one or more of the following (1) to (3). (1) NA/NB ratio which is the ratio of NA to NB, the number of pieces of each of the warp bundles observed in the regions with predetermined widths (W) in a cross section (A) in the longitudinal direction and in a cross section (B) in the short hand direction is 0.5 or less. (2) The widths of warp bundles observed in the cross section in the thickness direction are 0.3 mm or less. (3) Needle marks are present in all regions with an optional surface area of 3 mm × 3 mm on the mat surface.

Inventors:
SASAKI, Toshiaki (INC. 1, Fukuda-cho, Joetsu-sh, Niigata 11, 〒9428611, JP)
笹木 利明 (〒11 新潟県上越市福田町1番地 三菱樹脂株式会社内 Niigata, 〒9428611, JP)
KOBAYASHI, Tomoyuki (INC. 1, Fukuda-cho, Joetsu-sh, Niigata 11, 〒9428611, JP)
Application Number:
JP2010/069553
Publication Date:
May 12, 2011
Filing Date:
November 04, 2010
Export Citation:
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Assignee:
MITSUBISHI PLASTICS, INC. (2-2 Nihonbashi-Hongokucho 1-chome, Chuo-ku Tokyo, 21, 〒1030021, JP)
三菱樹脂株式会社 (〒21 東京都中央区日本橋本石町1丁目2番2号 Tokyo, 〒1030021, JP)
SASAKI, Toshiaki (INC. 1, Fukuda-cho, Joetsu-sh, Niigata 11, 〒9428611, JP)
笹木 利明 (〒11 新潟県上越市福田町1番地 三菱樹脂株式会社内 Niigata, 〒9428611, JP)
International Classes:
D04H1/42; D01F9/08; D04H1/46; F01N3/28
Attorney, Agent or Firm:
SHIGENO, Tsuyoshi (Nissin bldg, 9F 5-10, Shinjuku 2-chome, Shinjuku-k, Tokyo 22, 〒1600022, JP)
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