Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
INORGANIC FILLER POWDER, THERMALLY CONDUCTIVE POLYMER COMPOSITION, AND METHOD FOR MANUFACTURING INORGANIC FILLER POWDER
Document Type and Number:
WIPO Patent Application WO/2021/187415
Kind Code:
A1
Abstract:
An inorganic filler powder (3) that has a structure wherein the surface of inorganic particles (1) having a particle size of 1 μm or more is at least partially coated with inorganic microparticles (2) having a particle size of 10 nm or more and less than 0.1 μm, characterized in that the coating ratio of the surface of the inorganic particles (1) with the inorganic microparticles (2) is 30% or more.

Inventors:
NISHIYAMA MASASHI (JP)
NAGIRA TSUMORU (JP)
Application Number:
PCT/JP2021/010363
Publication Date:
September 23, 2021
Filing Date:
March 15, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C01F7/02; C01F7/44; C08K3/22; C08K9/02; C08L101/00; C09K5/14
Domestic Patent References:
WO2010093035A12010-08-19
Foreign References:
JP2002020652A2002-01-23
JPH05125223A1993-05-21
JP2012140510A2012-07-26
JPS6320340A1988-01-28
JPS62191420A1987-08-21
JP2020045795A2020-03-26
JP2021024242A2021-02-22
JP4361997B22009-11-11
JP2012121742A2012-06-28
JPH0651778B21994-07-06
JP2011016962A2011-01-27
JP4817683B22011-11-16
Other References:
See also references of EP 4122888A4
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF:



 
Previous Patent: ROTARY ACTUATOR

Next Patent: HEAT TREATMENT SYSTEM