Title:
INORGANIC REINFORCED SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/065205
Kind Code:
A1
Abstract:
[Problem] To provide an inorganic reinforced semi-aromatic polyamide resin composition that has mechanical properties (in particular, a balance between rigidity and toughness), has excellent thermal resistance and heat discoloration resistance, can suppress mold stains caused by outgas during melt molding, and has excellent melt fluidity and gelling properties. [Solution] The present invention provides an inorganic reinforced semi-aromatic polyamide resin composition containing 30%–73.5% by mass of a semi-aromatic polyamide (A), 1.5%–14% by mass of a modified olefin polymer (B), and 25%–65% by mass of an inorganic reinforcing material (C). The mass ratio (A/B) between the semi-aromatic polyamide (A) and the modified olefin polymer (B) is 5.5–20. The semi-aromatic polyamide (A) is at least one type of semi-aromatic polyamide including a repeating unit comprising a condensation of terephthalic acid and at least one type of aliphatic diamine including at least two carbon atoms. The terminal groups of the semi-aromatic polyamide (A) in the resin composition satisfy a specified relationship.
Inventors:
TAMATSUSHIMA MAKOTO (JP)
YAMADA JUN (JP)
AYUZAWA YOSHITAKA (JP)
YAMADA JUN (JP)
AYUZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2020/030391
Publication Date:
April 08, 2021
Filing Date:
August 07, 2020
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08G69/02; C08K3/013; C08L23/26; C08L77/00
Domestic Patent References:
| WO2006098434A1 | 2006-09-21 | |||
| WO2017077901A1 | 2017-05-11 | |||
| WO2015019882A1 | 2015-02-12 | |||
| WO2017217447A1 | 2017-12-21 |
Foreign References:
| JP2008179753A | 2008-08-07 | |||
| JPH083438A | 1996-01-09 |
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