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Title:
INSERT FOR A SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2012/165908
Kind Code:
A3
Abstract:
The present invention relates to an insert for a semiconductor package, and more particularly, to an insert for a semiconductor package comprising: an insert body having a package-accommodation groove formed therein; a package-fixing body which closes the package-accommodation groove when the semiconductor package is inserted into the package-accommodation groove so as to prevent the semiconductor package from escaping from the package-accommodation groove; an elastic support member which elastically supports the package-fixing body such that the package-fixing body moves in the direction of closing the package-accommodation groove; an open cover which is movable on the insert body in the directions of moving closer to or further from the insert body; and an open member which enables the package-fixing body to be movable in the direction of opening the package-accommodation groove. The package-fixing body has a lower surface which covers the entire upper surface of the semiconductor package so as to prevent the semiconductor package from escaping.

Inventors:
LEE JAE HAK (KR)
KANG KYOUNG WON (KR)
SONG JAE HYUN (KR)
Application Number:
PCT/KR2012/004357
Publication Date:
March 28, 2013
Filing Date:
June 01, 2012
Export Citation:
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Assignee:
ISC CO LTD (KR)
UNISEP CO LTD (KR)
LEE JAE HAK (KR)
KANG KYOUNG WON (KR)
SONG JAE HYUN (KR)
International Classes:
G01R31/26
Foreign References:
US20020190739A12002-12-19
US7477063B12009-01-13
KR20080086702A2008-09-26
KR101032648B12011-05-06
Attorney, Agent or Firm:
Y.P.LEE, MOCK & PARTNERS (Seocho-dong Seocho-gu, Seoul 137-875, KR)
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