Title:
INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/089657
Kind Code:
A1
Abstract:
A board surface detection unit (38) conducts imagery analysis of cross-sectional images of inspected bodies including boards and electronic parts, thereby specifying, out of the aforementioned cross-sectional images, the surface images which show board surfaces. A pseudo-cross-sectional-image generation unit (40) specifies, on the basis of the aforementioned surface images, the region of solder that joins the aforementioned board and the aforementioned electronic parts both of which are shown in the aforementioned cross-sectional images. Then the pseudo-cross-sectional-image generation unit (40) generates, in the imaging range, pseudo-cross-sectional-images which are thickened on a pseudo basis by piling up the aforementioned cross-sectional images which show the aforementioned solder. An inspection unit (42) conducts imagery analysis of the region of the aforementioned solder shown by the aforementioned surface images and of the region of the aforementioned solder shown by the aforementioned pseudo-cross-sectional-images, thereby estimating the acceptability of the joining condition of the aforementioned solder.
Inventors:
WADA TAKAHIKO (JP)
HIRAYAMA TAKUMA (JP)
HIRAYAMA TAKUMA (JP)
Application Number:
PCT/JP2010/002319
Publication Date:
July 28, 2011
Filing Date:
March 30, 2010
Export Citation:
Assignee:
SAKI CORP (JP)
WADA TAKAHIKO (JP)
HIRAYAMA TAKUMA (JP)
WADA TAKAHIKO (JP)
HIRAYAMA TAKUMA (JP)
International Classes:
G01N23/04; H05K3/34
Foreign References:
| JP2006226875A | 2006-08-31 | |||
| JP2008026334A | 2008-02-07 | |||
| JP3657242B2 | 2005-06-08 | |||
| JP2007114150A | 2007-05-10 |
Attorney, Agent or Firm:
MORISHITA, SAKAKI (JP)
Sakaki Morishita (JP)
Sakaki Morishita (JP)
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Claims: