Title:
INSPECTION FIXTURE
Document Type and Number:
WIPO Patent Application WO/2013/038726
Kind Code:
A1
Abstract:
An inspection fixture for detecting the state of the jet flow of a solder under the same conditions as with soldering with respect to a base material. In particular, this inspection fixture is equipped with: an inspection plate (102) which is heat resistant and thus is not deformed by the thermal effect of the solder, and which is translucent and thus enables the state of the contact of the solder with one surface to be visually recognized from the other surface; solder detection devices (103, 104) which detect the dipping height of the solder; and a support frame (101) capable of holding the inspection plate (102) and the solder detection devices (103, 104).
Inventors:
OKUYAMA HIROMITSU (JP)
Application Number:
PCT/JP2012/054374
Publication Date:
March 21, 2013
Filing Date:
February 23, 2012
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
OKUYAMA HIROMITSU (JP)
OKUYAMA HIROMITSU (JP)
International Classes:
B23K1/08; B23K1/00; B23K101/42
Foreign References:
| JPH03248767A | 1991-11-06 | |||
| JP2001257463A | 2001-09-21 | |||
| JPH05245626A | 1993-09-24 | |||
| JPH1117325A | 1999-01-22 | |||
| JP2001251048A | 2001-09-14 | |||
| JPH05277719A | 1993-10-26 | |||
| JPH01205593A | 1989-08-17 | |||
| JPH0259862U | 1990-05-01 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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Claims: