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Title:
INSPECTION JIG, INSPECTION JIG SET, AND SUBSTRATE INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/138380
Kind Code:
A1
Abstract:
[Problem] To provide an inspection jig, an inspection jig set, and a substrate inspection device capable of shortening inspection time while temperature stress is applied to a substrate to be inspected. [Solution] An inspection jig (3D) for inspecting a substrate (100) in which an inspection point (P1) to be inspected is set, wherein the inspection jig (3D) is provided with a probe (Pr) for making contact with the inspection point (P1), and a heating block (35D) having a contact surface (B1) for making contact with the substrate (100), the heating block (35D) heating the substrate (100) by heating the contact surface (B1).

Inventors:
MATSUKAWA Toshihide (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
KITAZAWA Kazutaka (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
NAKAYAMA Takafumi (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
TSUJIMOTO Masayuki (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
TAKAHASHI Tadashi (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
KADOTA Harumi (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
KUSUDA Tatsufumi (10 Tsutsumisoto-cho, Nishikyogoku, Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
Application Number:
JP2017/003115
Publication Date:
August 17, 2017
Filing Date:
January 30, 2017
Export Citation:
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Assignee:
NIDEC-READ CORPORATION (10 Tsutsumisoto-cho, Nishikyogoku Ukyo-ku, Kyoto-sh, Kyoto 54, 〒6150854, JP)
International Classes:
G01R1/073; G01R31/02; G01R31/26; G01R31/28; H05K3/00
Domestic Patent References:
WO2014207894A12014-12-31
Foreign References:
JP2007064883A2007-03-15
JP2014211412A2014-11-13
JP2011174863A2011-09-08
JP2010038639A2010-02-18
Attorney, Agent or Firm:
YANAGINO Takao et al. (Noskmard Building, 1-15-1 Miyahara, Yodogawa-ku, Osaka-sh, Osaka 03, 〒5320003, JP)
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