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Patent Searching and Data


Title:
INSPECTION METHOD, INSPECTION DEVICE, EXPOSURE MANAGEMENT METHOD, EXPOSURE SYSTEM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/081587
Kind Code:
A1
Abstract:
[Problem] To provide an inspection method with which it can be determined whether foreign matter adhered to a substrate support surface of an exposure stage has an effect on exposure results for a substrate. [Solution] This inspection method involves inspecting an exposure stage that supports a substrate when exposed by an exposure device, and is characterized in that the surface of the exposed substrate is illuminated with illumination light, the light reflected from a pattern on the illuminated surface is detected, the state of focus when the substrate pattern is exposed is determined from the reflected light that was detected, and the state of the exposure stage is inspected from the state of focus.

Inventors:
FUKAZAWA KAZUHIKO (JP)
Application Number:
PCT/JP2011/078819
Publication Date:
June 21, 2012
Filing Date:
December 13, 2011
Export Citation:
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Assignee:
NIKON CORP (JP)
FUKAZAWA KAZUHIKO (JP)
International Classes:
H01L21/027; G01B11/00; G01N21/94; G03F7/20
Domestic Patent References:
WO2009125805A12009-10-15
Foreign References:
JP2009277870A2009-11-26
JP2006080404A2006-03-23
JP2006105951A2006-04-20
JP2004294194A2004-10-21
JP2010153407A2010-07-08
JPH1090116A1998-04-10
JP2002168795A2002-06-14
JPH1116819A1999-01-22
JPH11352075A1999-12-24
Attorney, Agent or Firm:
KAWAKITA, KIJURO (JP)
Kijuro Kawakita (JP)
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Claims: