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Patent Searching and Data


Title:
INSPECTION METHOD AND INSPECTION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/034109
Kind Code:
A1
Abstract:
Through use of a plate-shaped inspection chip 10 having a plurality of pores 11 penetrating from one surface 10a to another surface 10b and having a constant pore diameter, a capture substance for specifically binding to a specific substance being immobilized on inside wall surfaces of the pores 11, and the pores 11 being shaped so as to be capable of retaining, by capillary action at atmospheric pressure, an inspection solution with which the pores 11 are filled, the other surface 10b is brought into contact with the inspection solution and the inspection solution is supplied into the pores 11, after which the inspection chip 10 is separated from the inspections solution stored in a container while the inspection solution remains retained in the pores 11 of the inspection chip 10, and light emitted from the inspection chip 10 is detected from vertically above the inspection chip 10.

Inventors:
ITO TAKAAKI (JP)
Application Number:
PCT/JP2017/026705
Publication Date:
February 22, 2018
Filing Date:
July 24, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G01N33/543; C12M1/00; C12Q1/68; G01N21/76; G01N33/53
Foreign References:
JP2005148048A2005-06-09
JPH0627111A1994-02-04
JP2006153889A2006-06-15
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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