Title:
INSULATING CIRCUIT BOARD AND INSULATING CIRCUIT BOARD MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/131256
Kind Code:
A1
Abstract:
An insulating circuit board (10a) of the present invention comprises: a metal substrate (20); an insulating layer (30) provided on one surface of the metal substrate (20); and a circuit layer (40) provided on the surface on the reverse side of the metal substrate (20) from the insulating layer (30). The circuit layer (40) has a circuit pattern and the circuit pattern includes a copper plate laminate (45) obtained by laminating two or more copper plates. In the copper plate laminate (45), the thickness of a copper plate positioned on the surface on the reverse side from the insulating layer (30) is within the range of 0.5-3.0 mm, inclusive.
Inventors:
ISHIKAWA FUMIAKI (JP)
SAKANIWA YOSHIAKI (JP)
YAMAGUCHI TOMOHIKO (JP)
SAKANIWA YOSHIAKI (JP)
YAMAGUCHI TOMOHIKO (JP)
Application Number:
PCT/JP2021/046068
Publication Date:
June 23, 2022
Filing Date:
December 14, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/12; H01L23/36; H05K1/02
Foreign References:
| JP2019149460A | 2019-09-05 | |||
| JP2014060216A | 2014-04-03 | |||
| JP2008282834A | 2008-11-20 | |||
| JP2006319146A | 2006-11-24 | |||
| JP2016076507A | 2016-05-12 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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