Title:
INSULATING DIELECTRIC ADHESIVE FILM AND PREPARATION METHOD THEREFOR, AND MULTILAYER PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/042418
Kind Code:
A1
Abstract:
An insulating dielectric adhesive film and a preparation method therefor, and a multilayer printed circuit board comprising the insulating dielectric adhesive film. The insulating dielectric adhesive film comprises a release film and an insulating dielectric layer provided on a surface of the release film. The insulating dielectric layer material comprises a saturated polyester resin, an amino resin or a blocked isocyanate, an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator. By introducing the saturated polyester resin component into the epoxy resin composition, the prepared insulating dielectric adhesive film has the advantages of a low dielectric constant, a low dielectric loss factor, resistance to thermal expansion, and good adhesion.
Inventors:
HE YUESHAN (CN)
LIU FEI (CN)
HE QIONG (CN)
LIU FEI (CN)
HE QIONG (CN)
Application Number:
PCT/CN2019/106789
Publication Date:
March 11, 2021
Filing Date:
September 19, 2019
Export Citation:
Assignee:
SHENZHEN NEWCCESS IND CO LTD (CN)
International Classes:
C09J7/30; C09J7/10; C09J163/00; C09J167/00; H05K3/28
Domestic Patent References:
| WO2017199764A1 | 2017-11-23 |
Foreign References:
| CN109135647A | 2019-01-04 | |||
| CN107779154A | 2018-03-09 | |||
| CN105838272A | 2016-08-10 | |||
| CN101538397A | 2009-09-23 |
Attorney, Agent or Firm:
JOHNSON INTELLECTUAL PROPERTY AGENCY(SHENZHEN) (CN)
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