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Patent Searching and Data


Title:
INSULATING HEAT DISSIPATION SHEET
Document Type and Number:
WIPO Patent Application WO/2019/164002
Kind Code:
A1
Abstract:
Provided is an insulating heat dissipation sheet which has both high thermal conductivity and high insulating properties. Specifically provided is an insulating heat dissipation sheet which is suitable for use as a heat dissipation member for electronic components. An insulating heat dissipation sheet which is composed of a silicone composition that contains hexagonal boron nitride at a content ratio of 40-70% by volume and a silicone resin at a content ratio of 30-60% by volume, and which is configured such that: the frequency particle size distribution of the hexagonal boron nitride has a maximum peak in the range of 35-100 μm and in the range of 10-25 μm and/or the range of 0.4-5 μm; and the average particle diameter of the hexagonal boron nitride is within the range of 30-80 μm.

Inventors:
WADA,Kosuke (Omuta Plant1,Shinkai-machi,Omuta-cit, Fukuoka 10, 〒8368510, JP)
YAMAGATA,Toshitaka (Omuta Plant1,Shinkai-machi,Omuta-cit, Fukuoka 10, 〒8368510, JP)
KANEKO,Masahide (Omuta Plant1,Shinkai-machi,Omuta-cit, Fukuoka 10, 〒8368510, JP)
Application Number:
JP2019/007140
Publication Date:
August 29, 2019
Filing Date:
February 25, 2019
Export Citation:
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Assignee:
DENKA COMPANY LIMITED (1-1Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 38, 〒1038338, JP)
International Classes:
H01L23/373; C08K3/38; C08K3/40; C08L83/04; H01L23/36; H05K7/20
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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