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Patent Searching and Data


Title:
INSULATING HEAT-TRANSFER SUBSTRATE, THERMOELECTRIC CONVERSION MODULE, AND METHOD FOR MANUFACTURING INSULATING HEAT-TRANSFER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2019/111997
Kind Code:
A1
Abstract:
This insulating heat-transfer substrate is characterized by comprising: a heat transfer layer comprising aluminum or an aluminum alloy; a conductive layer arranged on one surface of the heat transfer layer; and a glass layer formed between the conductive layer and the heat-transfer layer, wherein the conductive layer is composed of a sintered body of silver, and the thickness of the glass layer is within a range of 5-50 μm inclusive.

Inventors:
ARAI KOYA (JP)
NISHIMOTO SHUJI (JP)
KOMASAKI MASAHITO (JP)
NAGATOMO YOSHIYUKI (JP)
KUROMITSU YOSHIROU (JP)
Application Number:
JP2018/044892
Publication Date:
June 13, 2019
Filing Date:
December 06, 2018
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (Postcode1008117, JP)
International Classes:
H01L35/30; F25B21/02; H01L35/08; H01L35/34; H02N11/00
Foreign References:
JP2017059823A2017-03-23
JP2017157599A2017-09-07
JP2013168431A2013-08-29
JP2008244100A2008-10-09
JP2006237146A2006-09-07
JP2008078222A2008-04-03
JP2014011469A2014-01-20
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (Postcode1006620, JP)
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