Title:
INSULATING LAMINATED BODY OF ENAMEL RESIN, AND INSULATED WIRE AND ELECTRIC APPLIANCE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2014/123123
Kind Code:
A1
Abstract:
Provided are an insulating laminated body of enamel resin, and an inverter-surge resistant insulated wire and an electric appliance that include the insulating laminated body of enamel resin and a conductor. The insulating laminated body of enamel resin is formed to have a flat or tubular shape and provided with a foam region and a non-foam region on at least one surface of the foam region. The foam region is configured to include a bubble-free layer that does not contain bubbles, and, on both surface sides of the bubble-free layer, bubble layers comprising independent bubbles. The thickness of the bubble-free layer is thicker than the thickness of the partitions between the independent bubbles, and 5-60% of the thickness of the foam region. At least the bubble layers of the foam region are formed from a heat-curable resin.
Inventors:
MUTO DAISUKE (JP)
OYA MAKOTO (JP)
TOMIZAWA KEIICHI (JP)
OYA MAKOTO (JP)
TOMIZAWA KEIICHI (JP)
Application Number:
PCT/JP2014/052574
Publication Date:
August 14, 2014
Filing Date:
February 04, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
FURUKAWA MAGNET WIRE CO LTD (JP)
FURUKAWA MAGNET WIRE CO LTD (JP)
International Classes:
H01B7/02; B32B5/18; B32B27/08; H01B17/60; H01F5/06; H02K3/30
Domestic Patent References:
WO2013133333A1 | 2013-09-12 |
Foreign References:
JP2008226772A | 2008-09-25 | |||
JPS3621623B1 | ||||
JP4473916B2 | 2010-06-02 | |||
JP2012234625A | 2012-11-29 | |||
JPH0731944B2 | 1995-04-10 | |||
JP2005203334A | 2005-07-28 | |||
JPS3621623B1 | ||||
JP2009212034A | 2009-09-17 | |||
JP2012113836A | 2012-06-14 | |||
JP2012224714A | 2012-11-15 |
Other References:
See also references of EP 2955724A4
Attorney, Agent or Firm:
IIDA, Toshizo et al. (JP)
Toshizo Iida (JP)
Toshizo Iida (JP)
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