Title:
INSULATING MATERIAL FOR CIRCUIT BOARDS, METHOD FOR PRODUCING SAME AND METAL FOIL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/065285
Kind Code:
A1
Abstract:
The present invention provides: an insulating material for circuit boards, said insulating material having excellent dielectric characteristics in a high frequency range, while having a low linear expansion coefficient in all of the MD direction, the TD direction and the ZD direction, and being easily produced with excellent productivity; a method for producing this insulating material for circuit boards; and a metal foil-clad laminate or the like. An insulating material for circuit boards, said insulating material being provided with a multilayer body that comprises a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein: the thermoplastic liquid crystal polymer film contains an inorganic filler; and the multilayer body is a dry laminated multilayer body that is obtained by bonding the thermoplastic liquid crystal polymer film and the woven fabric with each other by means of thermocompression.
Inventors:
UCHIYAMA SHUN (JP)
MASUDA YUSUKE (JP)
MASUDA YUSUKE (JP)
Application Number:
PCT/JP2021/034528
Publication Date:
March 31, 2022
Filing Date:
September 21, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B5/02; B32B17/04; B32B27/18; C08J5/04; C08J5/18; H05K1/03
Foreign References:
| JP2005109042A | 2005-04-21 | |||
| JPH09309150A | 1997-12-02 | |||
| JP2019065061A | 2019-04-25 | |||
| JP2014237769A | 2014-12-18 | |||
| JP2014111699A | 2014-06-19 | |||
| JP2019052288A | 2019-04-04 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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