Title:
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METAL FOIL-CLAD LAMINATE
Document Type and Number:
WIPO Patent Application WO/2022/065270
Kind Code:
A1
Abstract:
Provided are a novel insulating material for a circuit substrate, a metal foil-clad laminate and the like, in which anisotropy of linear expansion coefficients in the MD direction, the TD direction, and the ZD direction is reduced. An insulating material for a circuit substrate of the present invention is provided with a thermoplastic liquid crystal polymer film, in which the ratio between average linear expansion coefficients in the MD direction, the TD direction, and the thickness direction (CTEMD, CTETD, CTEZ) measured by the TMA method conforming to JIS K7197 at 23 to 200 °C satisfies the following expressions (I) to (III). (I): 0.5 ≤ CTEMD/CTETD ≤ 1.5
(II): 0.10 ≤ CTEMD/CTEZ ≤ 1.00
(III): 0.10 ≤ CTETD/CTEZ ≤ 1.00
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Inventors:
UCHIYAMA SHUN (JP)
MASUDA YUSUKE (JP)
MASUDA YUSUKE (JP)
Application Number:
PCT/JP2021/034484
Publication Date:
March 31, 2022
Filing Date:
September 21, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B5/02; B32B7/025; B32B15/08; C08K3/00; C08L101/12; H05K1/03
Domestic Patent References:
| WO2020013106A1 | 2020-01-16 |
Foreign References:
| JP2008075079A | 2008-04-03 | |||
| JP2010080480A | 2010-04-08 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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