Title:
INSULATING-PARTICLE-ADHERED ELECTRICALLY CONDUCTIVE PARTICLE, PROCESS FOR PRODUCING INSULATING-PARTICLE-ADHERED ELECTRICALLY CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONNECTED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/014925
Kind Code:
A1
Abstract:
Provided is an insulating-particle-adhered electrically conductive particle which does not cause rusting in an electrically conductive layer, can maintain high electrical conductivity for a long period, and therefore can improve the electric power distribution reliability when used for connecting electrodes to each other.
This insulating-particle-adhered electrically conductive particle (1) comprises an insulating-particle-adhered electrically conductive particle main body (2) and a coating film (3) which coats the surface of the insulating-particle-adhered electrically conductive particle main body (2). The insulating-particle-adhered electrically conductive particle main body (2) comprises an electrically conductive particle (11) having an electrically conductive layer (13) formed on at least the surface thereof and insulating particles (15) which are adhered on the surface of the electrically conductive particle (11). The coating film (3) comprises a compound having a C6-22 alkyl group.
Inventors:
MAHARA, Shigeo (2-1, Hyakuyama, Shimamoto-cho, Mishima-gu, Osaka 21, 〒6180021, JP)
Application Number:
JP2011/067069
Publication Date:
February 02, 2012
Filing Date:
July 27, 2011
Export Citation:
Assignee:
SEKISUI CHEMICAL CO., LTD. (4-4 Nishitemma 2-chome, Kita-ku Osaka-sh, Osaka 65, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
積水化学工業株式会社 (〒65 大阪府大阪市北区西天満２丁目４番４号 Osaka, 〒5308565, JP)
International Classes:
H01B5/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (Chuo Odori FN Bldg, 3-8 Tokiwamachi 1-chome, Chuo-k, Osaka-shi Osaka 28, 〒5400028, JP)
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Claims: