Title:
INSULATING RESIN COMPOSITION, SUBSTRATE INTERLAYER INSULATING FILM, METHOD FOR MANUFACTURING SUBSTRATE INTERLAYER INSULATING FILM, AND SEMICONDUCTOR IC BUILT-IN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/190600
Kind Code:
A1
Abstract:
Provided is an insulating resin composition excelling in embeddability in metal wiring patterns, semiconductor IC, etc., even when highly filled with an inorganic filler. The insulating resin composition comprises an epoxy resin (A), a metal phosphinate (B) represented by general formula (1) below, and an inorganic filler (C), wherein the content of the inorganic filler (C) is 50 parts by mass or more per 100 parts by mass of a nonvolatile component of the insulating resin composition. (In general formula (1), R1 and R2 each independently represent a hydrogen atom, a linear or branched C1-16 alkyl group, a C5-8 cycloalkyl group, or a C6-10 aryl group, M is calcium, aluminum, or zinc, and m is an integer from 1-4.)
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Inventors:
YOSHIDA MASAKI (JP)
KUROKAWA TSUYOSHI (JP)
AOKI ISSEI (JP)
KUROKAWA TSUYOSHI (JP)
AOKI ISSEI (JP)
Application Number:
PCT/JP2022/000126
Publication Date:
September 15, 2022
Filing Date:
January 05, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08L63/00; B32B27/38; C08K3/013; C08K5/5313; C09D163/00; H01B3/40; H05K3/46
Domestic Patent References:
| WO2018074278A1 | 2018-04-26 |
Foreign References:
| JP2019178308A | 2019-10-17 | |||
| JP2013231094A | 2013-11-14 | |||
| JP2014173008A | 2014-09-22 | |||
| JP2010254819A | 2010-11-11 | |||
| JP2017057346A | 2017-03-23 | |||
| JP2009161578A | 2009-07-23 | |||
| CN111057217A | 2020-04-24 | |||
| JP2015504926A | 2015-02-16 | |||
| CN105061500A | 2015-11-18 |
Attorney, Agent or Firm:
WATANABE Kazuhira (JP)
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