Title:
INSULATING RESIN SHEET, MULTILAYER BODY AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/220261
Kind Code:
A1
Abstract:
An insulating resin sheet according to the present invention is formed from a curable resin composition that contains a thermosetting resin, a curing agent and an insulating heat-dissipating filler having a thermal conductivity of 10 W/m·K or more, wherein: the curing agent is composed of an imide oligomer; the thermal decomposition temperature of a cured product of this insulating resin sheet is 280°C or more; and the thickness of this insulating resin sheet is from 50 μm to 500 μm. The present invention is able to provide an insulating resin sheet which has excellent insulating properties, excellent thermal conductivity and high heat resistance, while being less susceptible to warping if used as a substrate.
Inventors:
SHINDO MASAMI (JP)
KOUMA AKI (JP)
MIZUNO SHOHEI (JP)
SHINJOU TAKASHI (JP)
WAKIOKA SAYAKA (JP)
OOWASHI KEIGO (JP)
KOUMA AKI (JP)
MIZUNO SHOHEI (JP)
SHINJOU TAKASHI (JP)
WAKIOKA SAYAKA (JP)
OOWASHI KEIGO (JP)
Application Number:
PCT/JP2022/017691
Publication Date:
October 20, 2022
Filing Date:
April 13, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J11/04; B32B15/08; C08J5/18; C08K3/00; C08L101/00; C09J7/35; C09J11/06; C09J201/00; H01B3/40; H01B17/56
Domestic Patent References:
| WO2012073851A1 | 2012-06-07 | |||
| WO2019083006A1 | 2019-05-02 |
Foreign References:
| JP2017149910A | 2017-08-31 | |||
| JP2009260232A | 2009-11-05 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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