Title:
INSULATING SHEET AND LAMINATED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/021167
Kind Code:
A1
Abstract:
Disclosed is an insulating sheet that has excellent handleability in an uncured state, can suppress excessive flow during lamination pressing, and further can provide a cured product having excellent dielectric breakdown properties, thermal conductivity, heat resistance, and processability. The insulating sheet is used for bonding a thermal conductor having a thermal conductivity of not less than 10 W/m·K to an electroconductive layer. The insulating sheet comprises a polymer (A) having a weight average molecule weight of not less than 10,000, at least one monomer of an epoxy monomer (B1) having an aromatic skeleton and having a weight average molecule weight of not more than 600 and an oxetane monomer (B2), a curing agent (C), 20 to 60% by volume of a first inorganic filler (D), and 1 to 40% by volume of at least one filler (E) of an organic filler (E1) and a second inorganic filler (E2) different from the first inorganic filler (D) and having a new Mohs hardness of 3 or less. In the case when the organic filler (E1) is contained, the content of the organic filler (E1) is 3 to 40% by volume.
Inventors:
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
KUSAKA YASUNARI (JP)
HIGUCHI ISAO (JP)
WATANABE TAKASHI (JP)
TAKAHASHI RYOUSUKE (JP)
KONDOU SYUNSUKE (JP)
AOYAMA TAKUJI (JP)
KUSAKA YASUNARI (JP)
HIGUCHI ISAO (JP)
WATANABE TAKASHI (JP)
TAKAHASHI RYOUSUKE (JP)
KONDOU SYUNSUKE (JP)
Application Number:
PCT/JP2009/054069
Publication Date:
February 25, 2010
Filing Date:
March 04, 2009
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
KUSAKA YASUNARI (JP)
HIGUCHI ISAO (JP)
WATANABE TAKASHI (JP)
TAKAHASHI RYOUSUKE (JP)
KONDOU SYUNSUKE (JP)
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
KUSAKA YASUNARI (JP)
HIGUCHI ISAO (JP)
WATANABE TAKASHI (JP)
TAKAHASHI RYOUSUKE (JP)
KONDOU SYUNSUKE (JP)
International Classes:
C09J7/02; B32B27/38; C09J11/04; C09J11/08; C09J163/00; C09J171/10; H01B3/00
Foreign References:
JPH10237410A | 1998-09-08 | |||
JPS59108072A | 1984-06-22 | |||
JP2006104300A | 2006-04-20 | |||
JP2004231808A | 2004-08-19 | |||
JP2001049220A | 2001-02-20 | |||
JP2006342238A | 2006-12-21 | |||
JPH08332696A | 1996-12-17 |
Other References:
See also references of EP 2316897A4
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (JP)
Miyazaki Chikara (JP)
Miyazaki Chikara (JP)
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