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Patent Searching and Data


Title:
INSULATING SHEET AND LAMINATED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2010/021167
Kind Code:
A1
Abstract:
Disclosed is an insulating sheet that has excellent handleability in an uncured state, can suppress excessive flow during lamination pressing, and further can provide a cured product having excellent dielectric breakdown properties, thermal conductivity, heat resistance, and processability. The insulating sheet is used for bonding a thermal conductor having a thermal conductivity of not less than 10 W/m·K to an electroconductive layer. The insulating sheet comprises a polymer (A) having a weight average molecule weight of not less than 10,000, at least one monomer of an epoxy monomer (B1) having an aromatic skeleton and having a weight average molecule weight of not more than 600 and an oxetane monomer (B2), a curing agent (C), 20 to 60% by volume of a first inorganic filler (D), and 1 to 40% by volume of at least one filler (E) of an organic filler (E1) and a second inorganic filler (E2) different from the first inorganic filler (D) and having a new Mohs hardness of 3 or less. In the case when the organic filler (E1) is contained, the content of the organic filler (E1) is 3 to 40% by volume.

Inventors:
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
KUSAKA YASUNARI (JP)
HIGUCHI ISAO (JP)
WATANABE TAKASHI (JP)
TAKAHASHI RYOUSUKE (JP)
KONDOU SYUNSUKE (JP)
Application Number:
PCT/JP2009/054069
Publication Date:
February 25, 2010
Filing Date:
March 04, 2009
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
MAENAKA HIROSHI (JP)
AOYAMA TAKUJI (JP)
KUSAKA YASUNARI (JP)
HIGUCHI ISAO (JP)
WATANABE TAKASHI (JP)
TAKAHASHI RYOUSUKE (JP)
KONDOU SYUNSUKE (JP)
International Classes:
C09J7/02; B32B27/38; C09J11/04; C09J11/08; C09J163/00; C09J171/10; H01B3/00
Foreign References:
JPH10237410A1998-09-08
JPS59108072A1984-06-22
JP2006104300A2006-04-20
JP2004231808A2004-08-19
JP2001049220A2001-02-20
JP2006342238A2006-12-21
JPH08332696A1996-12-17
Other References:
See also references of EP 2316897A4
Attorney, Agent or Firm:
MIYAZAKI, Chikara et al. (JP)
Miyazaki Chikara (JP)
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