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Patent Searching and Data


Title:
INSULATING SUBSTRATE AND HEAT DISSIPATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/106874
Kind Code:
A1
Abstract:
An insulating substrate (6) comprises: a wiring layer (1) having a mounting surface (1a) on which a heat-generating element (21) is mounted; and an insulating layer (4) that is disposed below the wiring layer (1) so as to be layered under the wiring layer (1). The mounting surface (1a) is the top surface of the wiring layer (1). The upper portion of the wiring layer (1) has an aluminum-carbon particle composite layer (2). The section of the wiring layer (1) below the composite layer (2) is a pure aluminum layer (3) having a purity of 99% or greater.

Inventors:
MINAMI KAZUHIKO (JP)
HIRANO TOMOYA (JP)
Application Number:
PCT/JP2018/026025
Publication Date:
June 06, 2019
Filing Date:
July 10, 2018
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
H01L23/14; H01B5/02; H01B5/14; H01L23/36; H05K1/09
Foreign References:
JP2016222962A2016-12-28
JP2017041592A2017-02-23
JP2011222669A2011-11-04
JP2017007172A2017-01-12
JP2015025158A2015-02-05
JP5150905B22013-02-27
Attorney, Agent or Firm:
SHIMIZU Yoshihito et al. (JP)
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