Title:
INSULATING THERMALLY CONDUCTIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/174023
Kind Code:
A1
Abstract:
This insulating thermally conductive resin composition (10) comprises a matrix resin (1) and insulating bodies (2) that are dispersed in the matrix resin and have electrical insulation properties. This insulating thermally conductive resin composition additionally comprises a thermally conductive phase (3) that has a higher thermal conductivity than the matrix resin and thermally connects the insulating bodies with each other. The thermally conductive phase (3) is composed of an organic material. Since this insulating thermally conductive resin composition uses an organic material as the thermally conductive phase that thermally connects the insulating bodies with each other, this insulating thermally conductive resin composition is able to achieve electrical insulation properties, while increasing thermal conductivity.
Inventors:
KOTANI YUKI
YODEN HIROYOSHI
YODEN HIROYOSHI
Application Number:
PCT/JP2015/002187
Publication Date:
November 19, 2015
Filing Date:
April 22, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/00; C08K3/22; C08K3/28; C08K3/38; C09K5/14; H01B3/00
Foreign References:
| JP2012122057A | 2012-06-28 | |||
| JP2000022289A | 2000-01-21 | |||
| JP2010132838A | 2010-06-17 | |||
| JP2012255086A | 2012-12-27 |
Other References:
See also references of EP 3144350A4
Attorney, Agent or Firm:
ITO, Masakazu et al. (JP)
Masakazu Ito (JP)
Masakazu Ito (JP)
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