Title:
INSULATION CIRCUIT BOARD TERMINAL, INSULATION CIRCUIT BOARD COMPOSITE BODY, AND SEMICONDUCTOR DEVICE COMPOSITE BODY
Document Type and Number:
WIPO Patent Application WO/2018/164206
Kind Code:
A1
Abstract:
[Problem] To provide an insulation circuit board terminal, which connects insulation circuit boards provided with a ceramic board and a metal plate, or which is coupled to the metal plate of this insulation circuit board and is used as an input/output terminal. [Solution] This insulation circuit board terminal 1B is used as an input/output terminal of an insulation circuit board 5 composed of a planar ceramic board 9 and at least one metal plate 10 coupled to a main surface of the ceramic board 9, or connects a plurality of insulation circuit boards 5 to each other, the insulation circuit board terminal being characterized by having a metallic plate body 2 which has a deficient portion 4 arranged or formed in a straight line shape on the top and/or bottom surface thereof.
Inventors:
KAMAE TAKAYUKI (JP)
KANAHARA NAOYUKI (JP)
MATSUNAGA HIDEKI (JP)
KANAHARA NAOYUKI (JP)
MATSUNAGA HIDEKI (JP)
Application Number:
PCT/JP2018/008872
Publication Date:
September 13, 2018
Filing Date:
March 07, 2018
Export Citation:
Assignee:
NGK ELECTRONICS DEVICES INC (JP)
NGK INSULATORS LTD (JP)
NGK INSULATORS LTD (JP)
International Classes:
H05K1/14; H01L25/00; H01L25/07; H01L25/18; H01R12/52; H01R12/55
Foreign References:
| JPH08236895A | 1996-09-13 | |||
| JP2010232254A | 2010-10-14 | |||
| JP2010129801A | 2010-06-10 | |||
| JPS57138364U | 1982-08-30 | |||
| JPS49147552U | 1974-12-19 | |||
| JP2013197104A | 2013-09-30 |
Attorney, Agent or Firm:
INOUE Hiroshi (JP)
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