Title:
INSULATION COVERED CONDUCTIVE PARTICLES, ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING ANISOTROPIC CONDUCTIVE FILM, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2018/139552
Kind Code:
A1
Abstract:
According to the present invention, each one of insulation covered conductive particles comprises a conductive base material particle and insulating fine particles that cover the surface of the base material particle, and has a sparse region where the number of the insulating fine particles per unit area is small or 0 and a dense region where the number of the insulating fine particles per unit area is larger than that of the sparse region.
Inventors:
MORIYA TOSHIMITSU (JP)
IZAWA HIROYUKI (JP)
AKAI KUNIHIKO (JP)
ICHIMURA TAKAYUKI (JP)
TANAKA MASARU (JP)
IZAWA HIROYUKI (JP)
AKAI KUNIHIKO (JP)
ICHIMURA TAKAYUKI (JP)
TANAKA MASARU (JP)
Application Number:
PCT/JP2018/002350
Publication Date:
August 02, 2018
Filing Date:
January 25, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01B5/00; C09J9/02; H01B1/00; H01B5/16; H01B13/00; H01R11/01; H01R43/00
Foreign References:
| JP2013016357A | 2013-01-24 | |||
| JP2005197089A | 2005-07-21 | |||
| JP2014207224A | 2014-10-30 | |||
| JP2007537570A | 2007-12-20 | |||
| JP2009507336A | 2009-02-19 | |||
| JP2015025104A | 2015-02-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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